Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290561 | Thermal interfaces for integrated circuit packages | Omkar G. Karhade, Kedar Dhane, Chandra Mohan Jha | 2019-05-14 |
| 10192810 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Rajendra C. Dias, Lars D. Skoglund | 2019-01-29 |