Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10523224 | Techniques for signal skew compensation | Carl Ebeling, Dana How, Mahesh A. Iyer | 2019-12-31 |
| 10461011 | Microelectronics package with an integrated heat spreader having indentations | Nicholas Neal, Chandra Mohan Jha, Kelly Lofgreen | 2019-10-29 |
| 10445278 | Interface bridge between integrated circuit die | Jeffrey Erik Schulz, Dinesh Patil, Gary Brian Wallichs, Keith Duwel, Jakob Raymond Jones | 2019-10-15 |
| 10439639 | Seemingly monolithic interface between separate integrated circuit die | Jeffrey Erik Schulz, Keith Duwel, Huy Ngo, Jakob Raymond Jones | 2019-10-08 |
| 10394737 | Multichip package with protocol-configurable data paths | Huy Ngo, Keith Duwel | 2019-08-27 |
| 10333535 | Techniques for signal skew compensation | Carl Ebeling, Dana How, Mahesh A. Iyer | 2019-06-25 |
| 10296479 | Scalable circuitry and method for control insertion | Gregg William Baeckler | 2019-05-21 |
| 10291442 | Low-skew channel bonding using phase-measuring FIFO buffer | Han Hua Leong | 2019-05-14 |
| 10241844 | Techniques for heat spreading in an integrated circuit | Rajiv Kane | 2019-03-26 |