Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10417169 | Methods and apparatus for high-speed serial interface link assist | Suresh Gordhanlal Andani, Peter Schepers | 2019-09-17 |
| 10291442 | Low-skew channel bonding using phase-measuring FIFO buffer | David W. Mendel | 2019-05-14 |