Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10439639 | Seemingly monolithic interface between separate integrated circuit die | David W. Mendel, Jeffrey Erik Schulz, Keith Duwel, Jakob Raymond Jones | 2019-10-08 |
| 10404627 | Multi-function, multi-protocol FIFO for high-speed communication | Keith Duwel, Vinson Chan, Divya Vijayaraghavan, Curt Wortman | 2019-09-03 |
| 10394737 | Multichip package with protocol-configurable data paths | Keith Duwel, David W. Mendel | 2019-08-27 |