Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461011 | Microelectronics package with an integrated heat spreader having indentations | Nicholas Neal, David W. Mendel, Chandra Mohan Jha | 2019-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461011 | Microelectronics package with an integrated heat spreader having indentations | Nicholas Neal, David W. Mendel, Chandra Mohan Jha | 2019-10-29 |