Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256198 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Sairam Agraharam, Omkar G. Karhade, Nitin A. Deshpande | 2019-04-09 |
| 10231338 | Methods of forming trenches in packages structures and structures formed thereby | Naga Sivakumar Yagnamurthy, Pramod Malatkar, Prasanna Raghavan, Robert M. Nickerson | 2019-03-12 |