Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446530 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Nicholas R. Watts | 2019-10-15 |
| 10438930 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Christopher L. Rumer, Nitin A. Deshpande | 2019-10-08 |
| 10231338 | Methods of forming trenches in packages structures and structures formed thereby | Naga Sivakumar Yagnamurthy, Huiyang Fei, Pramod Malatkar, Prasanna Raghavan | 2019-03-12 |