Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453799 | Logic die and other components embedded in build-up layers | Deepak Kulkarni, John S. Guzek | 2019-10-22 |
| 10446530 | Offset interposers for large-bottom packages and large-die package-on-package structures | Robert M. Nickerson, Nicholas R. Watts | 2019-10-15 |