Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453799 | Logic die and other components embedded in build-up layers | Russell K. Mortensen, John S. Guzek | 2019-10-22 |
| 10366951 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravindranath V. Mahajan | 2019-07-30 |