Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468331 | Heat management system | Je-Young Chang, Jae Whan Kim, Blake Rogers, Devdatta P. Kulkarni | 2019-11-05 |
| 10373893 | Embedded bridge with through-silicon vias | Aditya S. Vaidya, Digvijay A. Raorane, Paul R. Start | 2019-08-06 |
| 10366951 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2019-07-30 |
| 10236209 | Passive components in vias in a stacked integrated circuit package | Sujit Sharan, Stefan Rusu, Donald S. Gardner | 2019-03-19 |