Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10421432 | Tamper resistant lock assembly having physical unclonable functions | Victoria C. Moore, Ned M. Smith | 2019-09-24 |
| 10403578 | Electronic device package | Vipul V. Mehta | 2019-09-03 |
| 10373888 | Electronic package assembly with compact die placement | Eric J. Li, Vipul V. Mehta | 2019-08-06 |
| 10373893 | Embedded bridge with through-silicon vias | Aditya S. Vaidya, Ravindranath V. Mahajan, Paul R. Start | 2019-08-06 |
| 10375832 | Method of forming an interference shield on a substrate | Kemal Aygun, Daniel N. Sobieski, Drew W. Delaney | 2019-08-06 |
| 10199354 | Die sidewall interconnects for 3D chip assemblies | Mitul Modi | 2019-02-05 |