Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403578 | Electronic device package | Digvijay A. Raorane | 2019-09-03 |
| 10373888 | Electronic package assembly with compact die placement | Eric J. Li, Digvijay A. Raorane | 2019-08-06 |
| 10290592 | Semiconductor package, and a method for forming a semiconductor package | John J. Beatty, Suzana Prstic | 2019-05-14 |