| 10510669 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more |
2019-12-17 |
| 10475736 |
Via architecture for increased density interface |
Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch +3 more |
2019-11-12 |
| 10461047 |
Metal-free frame design for silicon bridges for semiconductor packages |
Dae-Woo Kim, Sairam Agraharam |
2019-10-29 |
| 10418312 |
Guard ring design enabling in-line testing of silicon bridges for semiconductor packages |
Arnab Sarkar, Dae-Woo Kim |
2019-09-17 |
| 10236209 |
Passive components in vias in a stacked integrated circuit package |
Ravindranath V. Mahajan, Stefan Rusu, Donald S. Gardner |
2019-03-19 |
| 10177083 |
Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages |
Dae-Woo Kim |
2019-01-08 |