Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Henning Braunisch, Prashant Parmar +3 more | 2019-11-12 |
| 10453812 | Polarization defined zero misalignment vias for semiconductor packaging | Hiroki Tanaka, Aleksandar Aleksov, Sri Ranga Sai Boyapati, Robert Alan May | 2019-10-22 |
| 10431537 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2019-10-01 |
| 10403564 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Hiroki Tanaka, Robert Alan May, Changhua Liu, Chung Kwang Christopher Tan +2 more | 2019-09-03 |
| 10361121 | Aluminum oxide for thermal management or adhesion | Sri Ranga Sai Boyapati | 2019-07-23 |