Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10494700 | Method of fabricating a microelectronic substrate | Sri Ranga Sai Boyapati, Amruthavalli Pallavi Alur, Daniel N. Sobieski | 2019-12-03 |
| 10453812 | Polarization defined zero misalignment vias for semiconductor packaging | Hiroki Tanaka, Aleksandar Aleksov, Sri Ranga Sai Boyapati, Kristof Darmawikarta | 2019-10-22 |
| 10431537 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2019-10-01 |
| 10403564 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Hiroki Tanaka, Kristof Darmawikarta, Changhua Liu, Chung Kwang Christopher Tan +2 more | 2019-09-03 |