| 10510669 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Chia-Pin Chiu, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2019-12-17 |
| 10492267 |
Display for stretchable computing device |
Adel A. Elsherbini, Sasha N. Oster, Nadine L. Dabby, Braxton Lathrop, Feras Eid |
2019-11-26 |
| 10475736 |
Via architecture for increased density interface |
Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch, Prashant Parmar +3 more |
2019-11-12 |
| 10477688 |
Stretchable electronic assembly |
Srinivas V. Pietambaram, Rahul N. Manepalli |
2019-11-12 |
| 10468357 |
Stretchable electronics fabrication method with strain redistribution layer |
Rajendra C. Dias, Tatyana N. Andryushchenko, Mauro J. Kobrinsky, David Staines |
2019-11-05 |
| 10453812 |
Polarization defined zero misalignment vias for semiconductor packaging |
Hiroki Tanaka, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta |
2019-10-22 |
| 10410939 |
Package power delivery using plane and shaped vias |
Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Yidnekachew S. Mekonnen +4 more |
2019-09-10 |
| 10403564 |
Dual-damascene zero-misalignment-via process for semiconductor packaging |
Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Changhua Liu, Chung Kwang Christopher Tan +2 more |
2019-09-03 |
| 10381291 |
Lithographacally defined vias for organic package substrate scaling |
Adel A. Elsherbini, Henning Braunisch, Brandon M. Rawlings, Feras Eid, Javier Soto |
2019-08-13 |
| 10368439 |
Assembly architecture employing organic support for compact and improved assembly throughput |
Adel A. Elsherbini, Sasha N. Oster, Shawna M. Liff |
2019-07-30 |
| 10353146 |
Flexible and stretchable optical interconnect in wearable systems |
Michael C. Rifani, Sasha N. Oster, Adel A. Elsherbini |
2019-07-16 |
| 10327331 |
Stretchable computing device |
Nadine L. Dabby, Adel A. Elsherbini, Braxton Lathrop, Sasha N. Oster |
2019-06-18 |
| 10327330 |
Stretchable electronic assembly |
Adel A. Elsherbini, Javier Soto Gonzalez, Dilan Seneviratne, Shruti R. Jaywant, Sashi S. Kandanur +5 more |
2019-06-18 |
| 10314171 |
Package assembly with hermetic cavity |
Feras Eid, Johanna M. Swan |
2019-06-04 |
| 10269942 |
Complementary tunneling FET devices and method for forming the same |
— |
2019-04-23 |
| 10263312 |
Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards |
Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff +3 more |
2019-04-16 |
| 10256521 |
Waveguide connector with slot launcher |
Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff +1 more |
2019-04-09 |
| 10251272 |
Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates |
Feras Eid, Thomas L. Sounart, Georgios Dogiamis, Johanna M. Swan |
2019-04-02 |
| 10249925 |
Dielectric waveguide bundle including a supporting feature for connecting first and second server boards |
Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan +3 more |
2019-04-02 |
| 10215164 |
Fabric-based piezoelectric energy harvesting |
Nadine L. Dabby, Feras Eid, Adel A. Elsherbini, Braxton Lathrop, Sasha N. Oster |
2019-02-26 |
| 10204855 |
Bendable and stretchable electronic devices and methods |
Alejandro X. Levander, Tatyana N. Andryushchenko, David Staines, Mauro J. Kobrinsky, Dilan Seneviratne +3 more |
2019-02-12 |
| 10206277 |
Gradient encapsulant protection of devices in stretchable electronics |
Rajendra C. Dias, Manish Dubey, Tatyana N. Andryushchenko, David Staines |
2019-02-12 |
| 10186465 |
Package-integrated microchannels |
Feras Eid, Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath +2 more |
2019-01-22 |