Issued Patents 2019
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508961 | Semiconductor package with air pressure sensor | Kevin Lin, Qing Ma, Feras Eid, Weng Hong Teh | 2019-12-17 |
| 10510669 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2019-12-17 |
| 10484120 | Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle | Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Erich N. Ewy | 2019-11-19 |
| 10483250 | Three-dimensional small form factor system in package architecture | Vijay K. Nair, Adel A. Elsherbini, Lakshman Krishnamurthy, Alexander Essaian, Torrey W. Frank | 2019-11-19 |
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch +3 more | 2019-11-12 |
| 10453635 | Package MEMS switch and method | Qing Ma, Valluri Rao, Feras Eid | 2019-10-22 |
| 10432167 | Piezoelectric package-integrated crystal devices | Adel A. Elsherbini, Feras Eid, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair +2 more | 2019-10-01 |
| 10424559 | Thermal management of molded packages | Feras Eid, Nader N. Abazarnia, Taesha D. Beasley, Sasha N. Oster, Tannaz Harirchian +1 more | 2019-09-24 |
| 10361142 | Dual-sided die packages | Henning Braunisch, Feras Eid, Adel A. Elsherbini, Don Nelson | 2019-07-23 |
| 10319896 | Shielded interconnects | Javier A. Falcon, Adel A. Elsherbini, Shawna M. Liff, Ye Seul Nam, James S. Clarke +2 more | 2019-06-11 |
| 10314171 | Package assembly with hermetic cavity | Aleksandar Aleksov, Feras Eid | 2019-06-04 |
| 10304804 | System on package architecture including structures on die back side | Fay Hua, Telesphor Kamgaing | 2019-05-28 |
| 10304686 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch | 2019-05-28 |
| 10291283 | Tunable radio frequency systems using piezoelectric package-integrated switching devices | Telesphor Kamgaing, Feras Eid, Adel A. Elsherbini, Georgios Dogiamis, Vijay K. Nair +1 more | 2019-05-14 |
| 10263312 | Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards | Sasha N. Oster, Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more | 2019-04-16 |
| 10256211 | Multi-chip-module semiconductor chip package having dense package wiring | Chuan Hu, Chia-Pin Chiu | 2019-04-09 |
| 10256521 | Waveguide connector with slot launcher | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Shawna M. Liff, Aleksandar Aleksov +1 more | 2019-04-09 |
| 10251272 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Aleksandar Aleksov, Feras Eid, Thomas L. Sounart, Georgios Dogiamis | 2019-04-02 |
| 10249925 | Dielectric waveguide bundle including a supporting feature for connecting first and second server boards | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff +3 more | 2019-04-02 |