Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508961 | Semiconductor package with air pressure sensor | Qing Ma, Feras Eid, Johanna M. Swan, Weng Hong Teh | 2019-12-17 |
| 10457548 | Integrating MEMS structures with interconnects and vias | Chytra Pawashe, Raseong Kim, Ian A. Young, Kanwal Jit Singh, Robert L. Bristol | 2019-10-29 |
| 10366903 | Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias | Robert L. Bristol, Alan M. Myers | 2019-07-30 |
| 10366950 | Bottom-up selective dielectric cross-linking to prevent via landing shorts | Robert L. Bristol, James M. Blackwell, Rami Hourani | 2019-07-30 |