Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490416 | Structures and methods for improved lithographic processing | James M. Blackwell | 2019-11-26 |
| 10457548 | Integrating MEMS structures with interconnects and vias | Kevin Lin, Chytra Pawashe, Raseong Kim, Ian A. Young, Kanwal Jit Singh | 2019-10-29 |
| 10366903 | Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias | Kevin Lin, Alan M. Myers | 2019-07-30 |
| 10366950 | Bottom-up selective dielectric cross-linking to prevent via landing shorts | Kevin Lin, James M. Blackwell, Rami Hourani | 2019-07-30 |
| 10269622 | Materials and deposition schemes using photoactive materials for interface chemical control and patterning of predefined structures | Rami Hourani, Michael J. Leeson, Todd R. Younkin, Eungnak Han | 2019-04-23 |
| 10269623 | Image tone-reversal with a dielectric using bottom-up cross-linking for back end of line (BEOL) interconnects | James M. Blackwell, Rami Hourani | 2019-04-23 |