| 10490416 |
Structures and methods for improved lithographic processing |
James M. Blackwell |
2019-11-26 |
| 10457548 |
Integrating MEMS structures with interconnects and vias |
Kevin Lin, Chytra Pawashe, Raseong Kim, Ian A. Young, Kanwal Jit Singh |
2019-10-29 |
| 10366903 |
Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias |
Kevin Lin, Alan M. Myers |
2019-07-30 |
| 10366950 |
Bottom-up selective dielectric cross-linking to prevent via landing shorts |
Kevin Lin, James M. Blackwell, Rami Hourani |
2019-07-30 |
| 10269622 |
Materials and deposition schemes using photoactive materials for interface chemical control and patterning of predefined structures |
Rami Hourani, Michael J. Leeson, Todd R. Younkin, Eungnak Han |
2019-04-23 |
| 10269623 |
Image tone-reversal with a dielectric using bottom-up cross-linking for back end of line (BEOL) interconnects |
James M. Blackwell, Rami Hourani |
2019-04-23 |