Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10457548 | Integrating MEMS structures with interconnects and vias | Kevin Lin, Chytra Pawashe, Raseong Kim, Ian A. Young, Robert L. Bristol | 2019-10-29 |
| 10446493 | Methods and apparatuses to form self-aligned caps | Boyan Boyanov | 2019-10-15 |