Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508961 | Semiconductor package with air pressure sensor | Kevin Lin, Feras Eid, Johanna M. Swan, Weng Hong Teh | 2019-12-17 |
| 10453635 | Package MEMS switch and method | Johanna M. Swan, Valluri Rao, Feras Eid | 2019-10-22 |