Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10321573 | Solder contacts for socket assemblies | Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan McAllister, Ting Zhong | 2019-06-11 |
| 10304686 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2019-05-28 |
| 10304804 | System on package architecture including structures on die back side | Telesphor Kamgaing, Johanna M. Swan | 2019-05-28 |