Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522450 | Pillar based socket | Saikumar Jayaraman | 2019-12-31 |
| 10431912 | CPU socket contact for improving bandwidth throughput | Zhichao Zhang | 2019-10-01 |
| 10396036 | Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices | Yu Zhang, Zhiguo Qian, Kemal Aygun, Yidnekachew S. Mekonnen, Sanka Ganesan +2 more | 2019-08-27 |
| 10321573 | Solder contacts for socket assemblies | Fay Hua, Hong Xie, Amit Abraham, Alan McAllister, Ting Zhong | 2019-06-11 |