AE

Adel A. Elsherbini

IN Intel: 29 patents #27 of 5,769Top 1%
Overall (2019): #956 of 560,194Top 1%
29
Patents 2019

Issued Patents 2019

Showing 25 most recent of 29 patents

Patent #TitleCo-InventorsDate
10492267 Display for stretchable computing device Sasha N. Oster, Nadine L. Dabby, Aleksandar Aleksov, Braxton Lathrop, Feras Eid 2019-11-26
10484120 Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan, Erich N. Ewy 2019-11-19
10483250 Three-dimensional small form factor system in package architecture Vijay K. Nair, Lakshman Krishnamurthy, Johanna M. Swan, Alexander Essaian, Torrey W. Frank 2019-11-19
10476545 Communication between integrated circuit packages using a millimeter-wave wireless radio fabric Telesphor Kamgaing, Sasha N. Oster, Brandon M. Rawlings, Georgios Dogiamis 2019-11-12
10468578 Package substrates with top superconductor layers for qubit devices Javier A. Falcon, Roman Caudillo, James S. Clarke 2019-11-05
10468737 Assembly and manufacturing friendly waveguide launchers Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing 2019-11-05
10452571 Microelectronic package communication using radio interfaces connected through waveguides Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Brandon M. Rawlings 2019-10-22
10446461 Complex cavity formation in molded packaging structures Sasha N. Oster, Joshua D. Heppner, Shawna M. Liff 2019-10-15
10432167 Piezoelectric package-integrated crystal devices Feras Eid, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair, Johanna M. Swan +2 more 2019-10-01
10410939 Package power delivery using plane and shaped vias Krishna Bharath, Mathew J. Manusharow, Mihir K. Roy, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more 2019-09-10
10381291 Lithographacally defined vias for organic package substrate scaling Henning Braunisch, Brandon M. Rawlings, Aleksandar Aleksov, Feras Eid, Javier Soto 2019-08-13
10380496 Quantum computing assemblies Javier A. Falcon, Hubert C. George, Shawna M. Liff, James S. Clarke 2019-08-13
10368439 Assembly architecture employing organic support for compact and improved assembly throughput Aleksandar Aleksov, Sasha N. Oster, Shawna M. Liff 2019-07-30
10361142 Dual-sided die packages Henning Braunisch, Feras Eid, Johanna M. Swan, Don Nelson 2019-07-23
10353146 Flexible and stretchable optical interconnect in wearable systems Aleksandar Aleksov, Michael C. Rifani, Sasha N. Oster 2019-07-16
10327268 Microelectronic package with wireless interconnect Telesphor Kamgaing, Emanuel Cohen 2019-06-18
10327331 Stretchable computing device Nadine L. Dabby, Braxton Lathrop, Sasha N. Oster, Aleksandar Aleksov 2019-06-18
10327330 Stretchable electronic assembly Aleksandar Aleksov, Javier Soto Gonzalez, Dilan Seneviratne, Shruti R. Jaywant, Sashi S. Kandanur +5 more 2019-06-18
10326211 Distributed on-package millimeter-wave radio Telesphor Kamgaing 2019-06-18
10319896 Shielded interconnects Javier A. Falcon, Johanna M. Swan, Shawna M. Liff, Ye Seul Nam, James S. Clarke +2 more 2019-06-11
10304686 Electronic devices with components formed by late binding using self-assembled monolayers Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan 2019-05-28
10291283 Tunable radio frequency systems using piezoelectric package-integrated switching devices Telesphor Kamgaing, Feras Eid, Georgios Dogiamis, Vijay K. Nair, Johanna M. Swan +1 more 2019-05-14
10263346 Single-package phased array module with interleaved sub-arrays Telesphor Kamgaing 2019-04-16
10263312 Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards Sasha N. Oster, Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff +3 more 2019-04-16
10256206 Qubit die attachment using preforms Javier A. Falcon, Ye Seul Nam, Roman Caudillo, James S. Clarke 2019-04-09