Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483250 | Three-dimensional small form factor system in package architecture | Vijay K. Nair, Adel A. Elsherbini, Lakshman Krishnamurthy, Johanna M. Swan, Torrey W. Frank | 2019-11-19 |
| 10217472 | System and method for data transmission over an audio jack | Indira Negi, Haibin Liu, Lakshman Krishnamurthy, Brian K. Vogel, Xiaochao Yang +2 more | 2019-02-26 |