Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483250 | Three-dimensional small form factor system in package architecture | Adel A. Elsherbini, Lakshman Krishnamurthy, Johanna M. Swan, Alexander Essaian, Torrey W. Frank | 2019-11-19 |
| 10475750 | Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration | Pramod Malatkar | 2019-11-12 |
| 10439671 | Microelectronic devices designed with high frequency communication modules having steerable beamforming capability | Telesphor Kamgaing, Georgios Dogiamis | 2019-10-08 |
| 10432167 | Piezoelectric package-integrated crystal devices | Adel A. Elsherbini, Feras Eid, Baris Bicen, Telesphor Kamgaing, Johanna M. Swan +2 more | 2019-10-01 |
| 10410983 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package | Telesphor Kamgaing, Georgios Dogiamis | 2019-09-10 |
| 10291283 | Tunable radio frequency systems using piezoelectric package-integrated switching devices | Telesphor Kamgaing, Feras Eid, Adel A. Elsherbini, Georgios Dogiamis, Johanna M. Swan +1 more | 2019-05-14 |