Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10499461 | Thermal head with a thermal barrier for integrated circuit die processing | Mohit Mamodia, Kyle Yazzie, Dingying Xu, Kuang Liu, Paul Diglio | 2019-12-03 |
| 10475750 | Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration | Vijay K. Nair | 2019-11-12 |
| 10290569 | Constrained cure component attach process for improved IC package warpage control | Kyle Yazzie, Venkata Suresh R. Guthikonda, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin +2 more | 2019-05-14 |
| 10278318 | Method of assembling an electronic component using a probe having a fluid thereon | Kyle Yazzie, Xiao Lu, Daniel Chavez-Clemente | 2019-04-30 |
| 10231338 | Methods of forming trenches in packages structures and structures formed thereby | Naga Sivakumar Yagnamurthy, Huiyang Fei, Prasanna Raghavan, Robert M. Nickerson | 2019-03-12 |