Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290569 | Constrained cure component attach process for improved IC package warpage control | Kyle Yazzie, Venkata Suresh R. Guthikonda, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. TRIBOLET +2 more | 2019-05-14 |