Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10499461 | Thermal head with a thermal barrier for integrated circuit die processing | Mohit Mamodia, Dingying Xu, Kuang Liu, Paul Diglio, Pramod Malatkar | 2019-12-03 |
| 10290569 | Constrained cure component attach process for improved IC package warpage control | Venkata Suresh R. Guthikonda, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. TRIBOLET +2 more | 2019-05-14 |
| 10278318 | Method of assembling an electronic component using a probe having a fluid thereon | Pramod Malatkar, Xiao Lu, Daniel Chavez-Clemente | 2019-04-30 |