Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10499461 | Thermal head with a thermal barrier for integrated circuit die processing | Mohit Mamodia, Kyle Yazzie, Kuang Liu, Paul Diglio, Pramod Malatkar | 2019-12-03 |
| 10168357 | Coated probe tips for plunger pins of an integrated circuit package test system | Wen Yin, Anna M. Prakash, Teag R. Haughan, Joaquin Aguilar-Santillan | 2019-01-01 |