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Communication between integrated circuit packages using a millimeter-wave wireless radio fabric |
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2019-11-12 |
| 10452571 |
Microelectronic package communication using radio interfaces connected through waveguides |
Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Georgios Dogiamis |
2019-10-22 |
| 10381291 |
Lithographacally defined vias for organic package substrate scaling |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Feras Eid, Javier Soto |
2019-08-13 |
| 10263312 |
Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards |
Sasha N. Oster, Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more |
2019-04-16 |
| 10249925 |
Dielectric waveguide bundle including a supporting feature for connecting first and second server boards |
Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan +3 more |
2019-04-02 |
| 10187998 |
Zero-misalignment via-pad structures |
Henning Braunisch |
2019-01-22 |