| 10504863 |
Variable ball height on ball grid array packages by solder paste transfer |
Eric J. Li, Jimin Yao |
2019-12-10 |
| 10468367 |
Solder in cavity interconnection structures |
Chuan Hu, Gregory S. Clemons |
2019-11-05 |
| 10446461 |
Complex cavity formation in molded packaging structures |
Sasha N. Oster, Adel A. Elsherbini, Joshua D. Heppner |
2019-10-15 |
| 10424559 |
Thermal management of molded packages |
Feras Eid, Nader N. Abazarnia, Johanna M. Swan, Taesha D. Beasley, Sasha N. Oster +1 more |
2019-09-24 |
| 10418329 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Amram Eitan, Mark Saltas |
2019-09-17 |
| 10380496 |
Quantum computing assemblies |
Adel A. Elsherbini, Javier A. Falcon, Hubert C. George, James S. Clarke |
2019-08-13 |
| 10368439 |
Assembly architecture employing organic support for compact and improved assembly throughput |
Adel A. Elsherbini, Aleksandar Aleksov, Sasha N. Oster |
2019-07-30 |
| 10319896 |
Shielded interconnects |
Javier A. Falcon, Adel A. Elsherbini, Johanna M. Swan, Ye Seul Nam, James S. Clarke +2 more |
2019-06-11 |
| 10305019 |
Piezoelectric devices fabricated in packaging build-up layers |
Feras Eid |
2019-05-28 |
| 10297567 |
Thermocompression bonding using plasma gas |
Donglai Lu, Jimin Yao, Amrita Mallik, George Kostiew |
2019-05-21 |
| 10263312 |
Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards |
Sasha N. Oster, Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more |
2019-04-16 |
| 10256205 |
Variable ball height on ball grid array packages by solder paste transfer |
Eric J. Li, Jimin Yao |
2019-04-09 |
| 10256521 |
Waveguide connector with slot launcher |
Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Aleksandar Aleksov +1 more |
2019-04-09 |
| 10249515 |
Electronic device package |
Jimin Yao, Eric J. Li |
2019-04-02 |
| 10249925 |
Dielectric waveguide bundle including a supporting feature for connecting first and second server boards |
Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan +3 more |
2019-04-02 |
| 10212827 |
Apparatus for interconnecting circuitry |
John J. Browne, Andrew Maclean |
2019-02-19 |