Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475715 | Two material high K thermal encapsulant system | Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Kuang-Han Chu, Liwei Wang +3 more | 2019-11-12 |
| 10297567 | Thermocompression bonding using plasma gas | Donglai Lu, Jimin Yao, George Kostiew, Shawna M. Liff | 2019-05-21 |