Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504863 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Shawna M. Liff | 2019-12-10 |
| 10297567 | Thermocompression bonding using plasma gas | Donglai Lu, Amrita Mallik, George Kostiew, Shawna M. Liff | 2019-05-21 |
| 10256205 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Shawna M. Liff | 2019-04-09 |
| 10249515 | Electronic device package | Eric J. Li, Shawna M. Liff | 2019-04-02 |