Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475715 | Two material high K thermal encapsulant system | Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu +3 more | 2019-11-12 |
| 10418329 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Mark Saltas | 2019-09-17 |