Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446499 | High density interconnect device and method | Mathew J. Manusharow | 2019-10-15 |
| 10410939 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2019-09-10 |
| 10312007 | Inductor formed in substrate | Mathew J. Manusharow, Harold Ryan Chase | 2019-06-04 |