Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522455 | Integrated circuit package substrate | Dustin P. Wood, Debendra Mallik | 2019-12-31 |
| 10490503 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Debendra Mallik, Jianyong Xie | 2019-11-26 |
| 10453795 | Microprocessor package with first level die bump ground webbing structure | Yu Zhang, Kemal Aygun, Mohiuddin M. Mazumder | 2019-10-22 |
| 10446499 | High density interconnect device and method | Mihir K. Roy | 2019-10-15 |
| 10410939 | Package power delivery using plane and shaped vias | Krishna Bharath, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2019-09-10 |
| 10312007 | Inductor formed in substrate | Mihir K. Roy, Harold Ryan Chase | 2019-06-04 |
| 10242942 | Integrated circuit package substrate | Dustin P. Wood, Debendra Mallik | 2019-03-26 |
| 10186465 | Package-integrated microchannels | Feras Eid, Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath +2 more | 2019-01-22 |