Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522455 | Integrated circuit package substrate | Mathew J. Manusharow, Debendra Mallik | 2019-12-31 |
| 10242942 | Integrated circuit package substrate | Mathew J. Manusharow, Debendra Mallik | 2019-03-26 |