Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10522455 | Integrated circuit package substrate | Mathew J. Manusharow, Dustin P. Wood | 2019-12-31 | $25,528,000 |
| 10490503 | Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same | Andrew Collins, Mathew J. Manusharow, Jianyong Xie | 2019-11-26 | $25,149,000 |
| 10403512 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2019-09-03 | $18,715,000 |
| 10366951 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2019-07-30 | $29,864,000 |
| 10242942 | Integrated circuit package substrate | Mathew J. Manusharow, Dustin P. Wood | 2019-03-26 | $18,583,000 |
| 10193493 | Multi-surface solar cell packaging for self-powered electronic devices | Joshua D. Heppner | 2019-01-29 | $23,219,000 |