Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483177 | Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging | John Lofgren, Santosh Pabba, Kevin Pounds, Alin Ila | 2019-11-19 |
| 10403512 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2019-09-03 |
| 10214340 | Containers for holding and dispensing stacks of electronic device components | Mingjie Xu, Pan Gu, Michael Garcia, Zhizhong Tang | 2019-02-26 |