Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483177 | Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging | Bassam M. Ziadeh, John Lofgren, Santosh Pabba, Alin Ila | 2019-11-19 |