Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510669 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2019-12-17 |
| 10438915 | High density substrate routing in package | Weng Hong Teh | 2019-10-08 |
| 10366951 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravindranath V. Mahajan | 2019-07-30 |
| 10320051 | Heat sink for 5G massive antenna array and methods of assembling same | — | 2019-06-11 |
| 10256211 | Multi-chip-module semiconductor chip package having dense package wiring | Chuan Hu, Johanna M. Swan | 2019-04-09 |
| 10199346 | High density substrate routing in package | Weng Hong Teh | 2019-02-05 |