Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10477688 | Stretchable electronic assembly | Aleksandar Aleksov, Rahul N. Manepalli | 2019-11-12 |
| 10438914 | Surface finishes for high density interconnect architectures | David Unruh | 2019-10-08 |
| 10431537 | Electromigration resistant and profile consistent contact arrays | Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON, Hiroki Tanaka +3 more | 2019-10-01 |
| 10403564 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Changhua Liu +2 more | 2019-09-03 |
| 10327330 | Stretchable electronic assembly | Aleksandar Aleksov, Adel A. Elsherbini, Javier Soto Gonzalez, Dilan Seneviratne, Shruti R. Jaywant +5 more | 2019-06-18 |
| 10204855 | Bendable and stretchable electronic devices and methods | Alejandro X. Levander, Tatyana N. Andryushchenko, David Staines, Mauro J. Kobrinsky, Aleksandar Aleksov +3 more | 2019-02-12 |
| 10199571 | Methods of manufacturing magnetoresistive MTJ stacks having an unpinned, fixed synthetic anti-ferromagnetic structure | Bengt J. Akerman, Renu Whig, Jason Janesky, Nicholas Rizzo, Jon Slaughter | 2019-02-05 |
| 10170428 | Cavity generation for embedded interconnect bridges utilizing temporary structures | Rahul N. Manepalli | 2019-01-01 |