Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431537 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more | 2019-10-01 |
| 10297563 | Copper seed layer and nickel-tin microbump structures | Rahul Jain, Kyu Oh Lee, Amanda E. Schuckman | 2019-05-21 |