| 10468374 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate |
Rahul Jain, Ji-Yong Park |
2019-11-05 |
| 10468352 |
Semiconductor packages with embedded bridge interconnects |
— |
2019-11-05 |
| 10446500 |
Semiconductor packages with embedded bridge interconnects |
— |
2019-10-15 |
| 10424561 |
Integrated circuit structures with recessed conductive contacts for package on package |
Islam A. Salama, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali |
2019-09-24 |
| 10384431 |
Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate |
Ji-Yong Park, Sri Chaitra Jyotsna Chavali, Siddharth K. Alur |
2019-08-20 |
| 10373951 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same |
Cheng Xu, Rahul Jain, Seo Young Kim, Ji-Yong Park, Sai Vadlamani +1 more |
2019-08-06 |
| 10373900 |
Tin-zinc microbump structures and method of making same |
Sri Chaitra Jyotsna Chavali, Amanda E. Schuckman |
2019-08-06 |
| 10297563 |
Copper seed layer and nickel-tin microbump structures |
Rahul Jain, Amanda E. Schuckman, Steve Cho |
2019-05-21 |