Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424530 | Electrical interconnections with improved compliance due to stress relaxation and method of making | Sri Chaitra Jyotsna Chavali | 2019-09-24 |
| 10384431 | Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate | Ji-Yong Park, Sri Chaitra Jyotsna Chavali, Kyu Oh Lee | 2019-08-20 |