Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424530 | Electrical interconnections with improved compliance due to stress relaxation and method of making | Siddharth K. Alur | 2019-09-24 |
| 10424561 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Islam A. Salama, Ram Viswanath, Robert L. Sankman, Babak Sabi | 2019-09-24 |
| 10384431 | Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate | Ji-Yong Park, Siddharth K. Alur, Kyu Oh Lee | 2019-08-20 |
| 10373900 | Tin-zinc microbump structures and method of making same | Amanda E. Schuckman, Kyu Oh Lee | 2019-08-06 |