Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424561 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2019-09-24 |
| 10306760 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Charan Gurumurthy, Hamid Azimi | 2019-05-28 |
| 10286488 | Acousto-optics deflector and mirror for laser beam steering | Chong Zhang | 2019-05-14 |