Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10306760 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Islam A. Salama, Charan Gurumurthy, Hamid Azimi | 2019-05-28 |
| 10290557 | Selective metallization of an integrated circuit (IC) substrate | Brandon C. Marin, Trina Ghosh Dastidar, Dilan Seneviratne, Sirisha Chava | 2019-05-14 |