Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424561 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Islam A. Salama, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2019-09-24 |
| 10187996 | Printed circuit board with a recess to accommodate discrete components in a package | Rajasekaran Swaminathan | 2019-01-22 |